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Micronax 340-50
Overview
Designed to Adhere to Rough Substrates
Micronax 340-50 DEV is a REACH-compliant* and APEO-free microsphere adhesive designed to deliver strong adhesion to rough, difficult-to-bond substrates, such as high-recycled-content corrugated cardboard. It combines high adhesion with reliable printability through direct thermal printers. The product offers excellent mechanical stability and low foam generation during coating. It is suitable for direct coating using processes such as Mayer rod, slot-die, gravure, and roll coating. Franklin A&P can also provide formulation customization to align with specific processing requirements. End use applications include linerless tamper evident labels and linerless labels requiring good printabilitly and very high adhesion.
Stability
Shelf Life, Storage, & Handling
Micronax 340-50 DEV will separate during storage; agitate at moderate speed with an appropriate air mixer prior to use (a small vortex should be visible). Continuous agitation is not required during production coating. Protect from freezing and temperatures ≥98°F. For best results, store below 85°F.
Technology
Adesivos de microesfera reposicionáveis
As microesferas são pequenas partículas esféricas que medem entre 10 e 250 mícrons de diâmetro. Embora tenham um tamanho microscópico, as esferas ainda são muito maiores do que as partículas de emulsão encontradas em adesivos convencionais, como nossa linha Covinax. Essa diferença de tamanho tem um impacto dramático na aderência adesiva. As esferas criam uma superfície adesiva descontínua que limita o contato físico com um substrato, resultando em fácil remoção e adesão estável ao longo do tempo.
Os adesivos de emulsão usam partículas menores que se aglutinam em um filme contínuo e nem sempre proporcionam fácil remoção sem deixar danos ou resíduos.
Features
Key Product Features
Manufacturing Specifications
Optimal Bonding
Performance
Standards & Compliance
Markets & Applications
Where Innovation Meets Application
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Technical Resources
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